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Telecom hybrid material PCB

Technical Parameters

Part Number:M04C33269 
Layer count:4
Board thickness:1.6mm
Raw material:PTFE+FR4
Copper thickness on the board surface:56um
Copper thickness in the hole barrel:25um
Min.line width/space:0.20mm
Minimum hole diameter:0.25mm
Surface finishing:immersion gold≥1u"

Technology Feature

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