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Telecom hybrid material PCB

Technical Parameters

Part Number：M04C33269 
Layer count：4
Board thickness：1.6mm
Dimension：118*57.5mm
Raw material：PTFE+FR4
Copper thickness on the board surface：56um
Copper thickness in the hole barrel：25um
Min.line width/space：0.20mm
Minimum hole diameter：0.25mm
Surface finishing：immersion gold≥1u"
Application：Communication

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