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Telecom high layer PCB

Technical Parameters

Part Number：M40C23268
Layer count: 40
Board thickness：3.0mm
Dimension：158*83.21mm 
Raw material：FR4 TG170 tuc
Copper thickness on the board surface：140um
Copper thickness in the hole barrel：50um
Min.line width/space：0.30mm
Minimum hole diameter：0.4mm 
Surface finishing：immersion gold≥1u"
Application：telecom power supply

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