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Telecom high layer PCB

Technical Parameters

Part Number:M40C23268
Layer count: 40
Board thickness:3.0mm
Raw material:FR4 TG170 tuc
Copper thickness on the board surface:140um
Copper thickness in the hole barrel:50um
Min.line width/space:0.30mm
Minimum hole diameter:0.4mm 
Surface finishing:immersion gold≥1u"
Application:telecom power supply

Technology Feature

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