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HDI for telecom module

Technical Parameters

Part Number：GHS04K03404
Layer count: 1 stage 4 layer 
Board thickness：0.6mm
Dimension：128*100.89mm
Raw material：FR4 EM825
Copper thickness on the board surface：≥35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.075mm
Minimum hole diameter：0.1mm 
Surface finishing：immersion gold≥2u"+OSP
Application：telecom module

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