Engaging in PCB R&D and manufacturing for 11 years Leading the innovation of PCB technology

HDI for telecom module

Technical Parameters

Part Number:GHS04K03404
Layer count: 1 stage 4 layer 
Board thickness:0.6mm
Raw material:FR4 EM825
Copper thickness on the board surface:≥35um
Copper thickness in the hole barrel:20um
Min.line width/space:0.075mm
Minimum hole diameter:0.1mm 
Surface finishing:immersion gold≥2u"+OSP
Application:telecom module

Technology Feature

*Your info requiredLeave your contact info to ask for more product details
* Contact name:
Company name:
* Phone number:
* Mobile: Please fill in your contact telephone number
* Your message: